Hon Hai Technology Group (Foxconn) is emphasising full value-chain integration across semiconductors, systems and AI infrastructure as a key factor in improving ecosystem collaboration, flexibility and supply chain resilience as AI workloads continue to scale.
Foxconn executives Young Liu, Chairman, and Dr Bob Chen, President of the company’s Semiconductor Business Group, outlined the company’s perspective on the future of AI infrastructure at major semiconductor industry events in Taiwan.
Speaking at SEMICON Taiwan, Liu highlighted the need for greater collaboration across Taiwan’s technology ecosystem as the pace of AI development accelerates. He said the industry needs to move beyond the traditional concept of products being “Made In Taiwan” towards an ecosystem approach of being “Made With Taiwan”, reflecting greater collaboration among technology companies and partners.
At imec’s ITF Taiwan, Chen said organisations are increasingly building infrastructure specifically to generate intelligence rather than simply support applications. He argued that the system itself is becoming a key unit of innovation and competition, requiring the industry to optimise the entire technology stack rather than individual components.
According to Chen, future advances in AI infrastructure could increasingly depend on system architecture that brings compute, memory, connectivity and power closer together. Technologies including chiplets, 3D integration, silicon photonics and memory-centric architectures could help AI systems deliver greater intelligence per watt.
Chen also highlighted the growing interdependence between semiconductor and system-level innovation, with design decisions spanning devices, packaging, interconnects and complete systems. This convergence, he said, creates opportunities for collaboration between industrial system builders such as Foxconn and research organisations such as imec.
Liu, who also leads the Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA), said the scale and speed of AI-driven change is unprecedented. He highlighted Taiwan’s technology supply chain and its ability to adapt rapidly as potential foundations for deeper collaboration among manufacturers, technology companies and international partners.
