Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced the MV3564 and MV3514 frequency synthesizers, two new pin- and feature-compatible devices designed for wireless communications, AI data center and physical AI applications. Leveraging TSMC’s 40nm radio frequency (RF) CMOS process, the devices deliver 75 fs total jitter at just 150 mW, 10× lower power than existing products with comparable jitter performance, and integrate the VCO and multi-chip phase synchronization to dramatically reduce footprint and system complexity. Movandi will showcase the new frequency synthesizers and its latest connectivity technologies at LEAP 2026 in Riyadh, Saudi Arabia, August 31–September 3, at Booth H5.A54.
As wireless and AI systems scale, precise clock generation and synchronization must deliver higher performance while reducing power and size. The MV3564 and MV3514 address this challenge through a highly integrated architecture, enabling standalone, co-packaged and emerging chiplet implementations with a path towards monolithic integration.
“AI is reshaping infrastructure, demanding higher frequencies, data rates, and densities, and connectivity is quickly becoming the critical bottleneck,” said Maryam Rofougaran, CEO and co-founder of Movandi. “The MV3564 and MV3514 combine ultra-low jitter, exceptionally low power and precise multi-chip synchronization in a highly integrated architecture. By bringing these capabilities together, we’re giving system designers a scalable clocking platform for the next generation of wireless networks, AI data centers, robots and drones.”
The MV3564 and MV3514 combine integrated VCOs with advanced frequency and phase control to support systems with clock requirements from 4 GHz to THz frequencies. The two devices are pin- and feature-compatible while providing complementary frequency coverage, giving designers a scalable architecture across multiple system configurations.
“Driving next-generation wireless systems in the AI era requires a fundamental shift in power efficiency and integration,” said Sajiv Dalal, President and CEO of TSMC North America. “We are pleased to partner with innovators like Movandi, combining their groundbreaking design with TSMC’s leading process technologies to deliver the high-performance, energy-efficient silicon that will power the future of connectivity.”
